Premium Phenolic Resins: Polimɛriw minnu bɛ se ka thermosetting (Polymères versatile thermosetting) kɛ ka ɲɛsin baarakɛcogo ɲuman ma
Baarakɛyɔrɔbaw
1. Baarakɛcogo jɔnjɔnw Industriw ka fɛn dilanni na
Fenɔli resinw nafa ka bon u seko la ka fɛn gɛlɛnw dilan, minnu janya bɛ sabati funteni ni degun kɔrɔ:
Kompoziw ni Laminatiw:
Aerospace : A bɛ kɛ awiyɔn kɔnɔna panɛriw la, motɛri yɔrɔw la, ani funteni-bɔlanw na k’a sababu kɛ u ka sisi bɔli dɔgɔyali ye ani u tɛ tasuma kɛlɛ (misali la, FAR 25.853 labatoli jagokɛla ka awiyɔnw na).
Kɔgɔjida la: Kurun kɔnɔna ni kurunba kɔnɔ, fenɔli fɛnɲɛnamafagalanw bɛ ji minɛ ani ka sɔgɔsɔgɔ, u bɛ baara kɛ ka tɛmɛ laadala fibreglasi kan kɔgɔji laminiw na.
Foundry ani Moulew dilanni:
Novolac resin, ni hɛkɛsametilɛnitɛtaramini faralen don ɲɔgɔn kan, olu bɛ kɛ cɛncɛn sɔgɔli la mobili motɛri yɔrɔw kama (misali la, silinda kunw). U ka funteni sabatili ka bon, o bɛ kɛ sababu ye ka mɔli caman ɲɔgɔnna kɛ tigitigi ni u sɔgɔli funteni tɛmɛna 1500°C kan.
2. Ɛntɛrinɛti ni kuran baarakɛyɔrɔ
Circuits imprimés (PCB) minnu bɛ wele ko:
Resole resinw ye fɛnba ye epoxy-phenolic laminates kɔnɔ PCBw kɔnɔ, u bɛ dielektriki fanga caman di ani u bɛ sabatili kɛ u hakɛ la ka ɲɛsin baarakɛcogo caman ma (misali la, 5G kumaɲɔgɔnya minɛnw).
Kuranko ɲɛnabɔli:
Fenɔli yɔrɔ minnu dilannen don (misali la, switchgear yɔrɔw, terminal blocks) bɛ arc resistance ɲuman di ani ka funteni sabati, ka UL 94 V-0 tasumako sariyaw dafa kuran lakanani kama.
3. Mobili ni mɔbiliko seko ni dɔnko
Fɛn minnu bɛ kɛ ka fɛnw jukɔrɔ:
Fenɔli resinw bɛ kɛ debriya platiw la, freinw la, ani transmission yɔrɔw la k’a sababu kɛ u bɛ se ka funteni kɛlɛ (fo ka se 250°C ma) ani u ka degun masin na. Misali la, Erɔpu mobili iziniw kɔnɔ, fɛn minnu bɛ kɛ ni fenɔli ye, olu bɛ dɔ bɔ freinw tiɲɛni na mobili minnu bɛ baara kɛ kosɛbɛ.
Composites minnu ka nɔgɔn:
Ni u barika bonyalen don ni gilasi walima fibre carbone ye, fenɔli fɛnɲɛnamafagalanw bɛ kɛ kamiyɔnw kɔnɔ ani tɛrɛn kɔnɔna na walasa ka dɔ bɔ girinya la ka sɔrɔ ka jɔli dafalen ni tasuma lakanani sabati (misali la, EN 45545-2 labatoli nɛgɛso bolicogo la).
4. So jɔli ni so jɔli minɛnw
Tasuma-fagalan minnu bɛ kɛ:
Fenɔli resinw bɛ dilan ka kɛ penti intumescentw ye minnu bɛ bonya ka kɛ char layer lakananen ye funteni caman na, o bɛ sow jɔcogo binni bila kɔfɛ (misali la, jagokɛyɔrɔ sanfɛyɔrɔw Azi jamanaw na).
Panneau d’isolation:
Fenɔli fomu, min ka funteni bɛ 0,02 W/m·K, o bɛ kɛ sigiyɔrɔw ni iziniw kɔnɔ, a bɛ tasuma kunbɛn ka ɲɛ ni a bɛ tali kɛ poliyuritan fomu la.
Nɔrɔlanw ni Sigilanw:
Fɛnɲɛnɛma minnu bɛ kɛ ni fenɔli ye, olu bɛ jiri, nɛgɛ ani seramiki siri jɔli baara la (misali la, jirisunw lamininenw so modulariw kɔnɔ), o bɛ kɛ sababu ye ka muɲuli kuntaalajan di ani ka se ka ji kɛlɛ.
5. Baarakɛminɛnw ni baarakɛcogo kɛrɛnkɛrɛnnenw
Cuisini ni sanuyaso fɛnw:
Fenɔli resin minnu dilannen don, olu bɛ fɛnw dilan minnu bɛ mɛn, minnu tɛ funteni kɛlɛ, minnu bɛ se ka kɛ fɛnw ye minnu bɛ se ka kɛ fɛnw ye minnu bɛ se ka kɛ fɛnw ye minnu bɛ se ka kɛ fɛnw ye minnu bɛ se ka kɛ fɛnw ye minnu bɛ se ka kɛ fɛnw ye. U yɔrɔ min tɛ porose ye, o bɛ nɔgɔ ni kemikɛlifɛnw kɛlɛ, o b’a to u ka ɲi jagokɛlaw ka dumunikɛyɔrɔw la.
Fɛn minnu bɛ kɛ ka fɛnw sɔgɔ:
Resole resinw bɛ kisɛw siri minnu bɛ sɔgɔsɔgɔ (misali la, aluminiyɔmu ɔkisidi, siliyɔmu karɔbidi) cɛncɛn papiyew kɔnɔ, sɔgɔli wotoro kɔnɔ, ani tigɛ disiki la, o bɛ a to baara kɛcogo bɛ kɛ cogo basigilen na jiriw dilanni ni nɛgɛ dilanni na.
Kɛrɛnkɛrɛnnenya la
| Fɛn dilannen Tɔgɔ | Asidi Propionic (Asidi Propionic) ye | |||||||||
| Formula chimique (Formule chimique) ye | C3H6O2 ye | |||||||||
| Molecules (molecules) girinya | 74,08 g/mol | |||||||||
| Yecogo | Ji jɛlen min tɛ kulɛri ye | |||||||||
| Fɛn min bɛ kɛ ka fɛnw wuli | -20,8°C ye | |||||||||
| Tobilikɛyɔrɔ | 141,1°C ye | |||||||||
| Hakɛ | 0,993 g/cm3 ye | |||||||||
| CAS NO | 79 - 09 - 4. Bamako, Mali | |||||||||
| HS Kode ye | 29155000 ye | |||||||||
| EINECS NO | 201 - 176 - 3. Bamako, Mali | |||||||||
| Waleyali | A bɛ kɛ plastikiw la, furaw la, dumuniw na, furajiw la ani tulumafɛnw na | |||||||||
Jogoɲumanya kɔlɔsili sɛbɛn
| Fɛn dilannen Tɔgɔ | Asidi Propionic (Asidi Propionic) ye | ||||||
| MINƐN | NAFA STANDARD (%) . | KƆRƆBƆLI NAFA(%) . | |||||
| Asidi poropiyɔni hakɛ, w/%≥ | 99,5 | 99,9 ye | |||||
| Density(20/20°C) ye. | 0,993-0,997 ye | 0,996 ye | |||||
| Tobilikɛyɔrɔ/°C | 138,5-142,5 ye | 139.4-141.1.1. Bamako, Mali | |||||
| Evaporation tolen,w/%≤ | 0,01 ye | 0,006 ye | |||||
| Ji,w/%≤ | 0,15 ye | 0,02 ye | |||||
| Aldehyde,w/%≤ ye | ≤0,05 ye | 0,04 ye | |||||
| oksidan nɔgɔman,w/%≤ | ≤0,05 ye | 0,01 ye | |||||
| Pb mg/kg≤ | 2.0 | ≤2,0 ye | |||||
| I n’a fɔ miligaramu/kg≤ | 3.0 | ≤3,0 ye | |||||
| Kuncɛli | Aw bɛ GB 1886.210-2016 sariyaw labato | ||||||
Jogo ɲuman & sariya labatoli
Formulasi sɛgɛsɛgɛli:
A bɛ se ka ladilan ka kɛɲɛ ni nafolo kɛrɛnkɛrɛnnenw ye:
Funteni kunbɛnni ka bon: Glass transition temperature (Tg) fo ka se 300°C ma sanfɛla baarakɛcogo la.
Sisi bɔli dɔgɔyali : Jatebɔ caman sɛmɛntiyalen don tɛmɛsira ni kɔgɔjida laminiw na (misali la, IMO FTPC tilayɔrɔba 1 bɛ bɛn).
Sariyasunw ka sariyaw:
A bɛ UL, ASTM, ani ISO 9001:2015 sariyaw dafa. Dumunifɛnw tali hakɛw (misali la, fenɔli resin minnu bɛ minɛnw bolow la) bɛ bɛn FDA 21 CFR 177.1020 ma.
Mɛli:
A dilannen don ni fenɔli bɔlenw ye minnu bɛ bɔ biyo la (misali la, kafeminkutu jilama) fura dɔw la, o bɛ dɔ bɔ a jigi da petoroli la. A bɛ se ka segin ka kɛ jeni ye ni fanga sɔrɔli ye.
Mun na an bɛ an ka fenɔli resinw sugandi?
I mago bɛ tasuma-minɛnw na minnu bɛ se ka kɛlɛ sanfɛla la, i mago bɛ fɛnw na minnu bɛ se ka sɔgɔsɔgɔ kosɛbɛ mobili kama, walima i mago bɛ fɛnw na minnu bɛ mɛn senna walasa ka jɔ, an ka fenɔli resinw bɛ dannaya di min ɲɔgɔn tɛ. Ni diɲɛ kɔnɔ fɛɛrɛbɔ dɛmɛni ni fɛn dilanni yɔrɔw bɛ Ameriki Woroduguyanfan, Erɔpu ani Azi, an bɛ furaw di minnu bɛ kɛ ka kɛɲɛ ni mɔgɔw sago ye — k’a ta novolac/resole ɲagaminenw na ka taa a bila grade barikamaw la — walasa ka i ka application ka ɲinini gɛlɛnw dafa.
Aw ye siniɲɛsigi injiniyɛri kɛ ni Premium Phenolic Resins ye—yɔrɔ min na funteni, kemikɛli ani masinw ka se ka fɛnw kɛcogo ɲɛfɔ kokura.








